Semiconductor & IC packaging materials are known to protect the electronic components such as semiconductors and ICs from external impact, corrosion, and so on. These packaging materials are used along with various advanced packaging technologies for the packaging of semiconductors and integrated circuits.
Browse 70 market data Tables and 32 Figures spread through 183 Pages and in-depth TOC on “Semiconductor & IC Packaging Materials Market by Types (Organic Substrates, Bonding Wires, Leadframes, Ceramic Packages, & so on), Packaging Technologies (SOP, GA, QFN, DFN, & Others), & Geography - Regional Trends & Forecast to 2019”
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The semiconductor and IC packaging technologies such as SOP, GA, QFN, DFN, and many more are used in the manufacturing of electronic packaging components. The end-user industries such as mobile phones, flat panel displays, and consumer electronics use components in the internal circuits.
In the recent economic downturn, the end-users industries for electronic packaging materials experienced a decline of around 5% to 10%. However, as a result of improvements in the global economy since 2009, the end-user industries have witnessed a marginal growth ranging from 4% to 6% which is reflected in the electronic packaging materials segments as well. For example, the electronics industry, which experienced a decline by over 20% in 2008-2009, grew by 4% in 2010, and remained the same for 2011 and 2012.
The end-user industry is always at the look-out of better innovations and technological advancements which can serve their customers better.
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The semiconductor & IC packaging materials market to reach $26 million by 2019
The market for semiconductor and IC packaging materials in terms of revenue is expected to reach $26 million by 2019, growing at a CAGR of 4.5% from 2014 to 2019. Asia-Pacific dominated the semiconductor and IC packaging materials market revenues in 2013. Asia-Pacific is expected to remain the major by 2019, growing at a CAGR of 5.0% from 2014 to 2019. ROW is expected to be the fastest growing markets, growing at a CAGR of 3.5% from 2014 to 2019. Europe and North America are estimated to grow at a slower CAGR of 3.0% and 3.2% respectively from 2014 to 2019, owing to the rising consumption in the Asia-Pacific region, where end-user markets of semiconductor and IC packaging materials are growing steadily.
Asia-Pacific alone accounted for more than 68% of the semiconductor & IC packaging materials revenues in 2013
Asia-Pacific is the largest semiconductor and IC packaging market, with major developments in China, Japan, Taiwan, and South Korea. Asia-Pacific alone accounted for 68% of the semiconductor and IC packaging materials revenue in 2013. This region is expected to dominate the market by 2019, with advanced technological developments in electronic packaging materials for end-users. Asia-Pacific is expected to remain the major semiconductor and IC packaging market by 2019, with high investments in emerging applications due to growing population and demand.
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